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Issue Date	Title	Author(s)
2000	Review on policies, research & development in microelectronic industry in Malaysia	Ahmad, I.B. ; Sulaiman, N.B.
2002	Characterisation of polysilicon gate microstructures for 0.5 μm CMOS devices using transmission electron microscopy and atomic force microscopy images	Ahmad, I. ; Omar, A. ; Hussain, A. ; Mikdad, A.
2002	Development of a simple in situ instrumentation for detection of breath alcohol and gas leak	Wagiran, R. ; Chong, A.G.E. ; Ahmad, I. ; Salleh, A.B.
2002	Pass transistor logic ALU design	Wagiran, R. ; Chong, A.B. ; Ahmad, I.
2004	Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top	Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K.
2002	MATLAB based image analysis software for characterization of microstructure materials	Hussain, A. ; Muad, A.M. ; Ahmad, I. ; Azhari, C.H.
2003	Electrical testing for MEMS's piezoresistive pressure sensor	Abd Wahab, M.Z.B. ; Sauli, Z.B. ; Ahmad, I. ; Suradi, W.B.
2004	The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition	Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2004	Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)	Kornain, Z. ; Ahmad, I. ; Omar, G.
2004	An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devices	Omar, A. ; Kamariah, S. ; Ahmad, I.
2004	An alternative approach to measures the application of dispatching rule in the wafer foundry	Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y.
2004	Alternative double pass dicing method for thin wafer laminated with die attach film	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2004	A simulation approach for dispatching techniques comparison in 200mm wafer foundry	Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y.
2004	Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices	Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I.
2006	The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition	Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2005	Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump	Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2006	Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2006	Effect of wafer thinning methods towards fracture strength and topography of silicon die	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2006	Modelling of sacrificial spin-on glass (SOG) etching in non-straight microchannels using hydrofluoric acid	Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I.
2006	Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation	Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I.