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Issue Date	Title	Author(s)
2006	The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition	Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U.
2006	A study on inter-metallic compound formation and structure of lead free SnAgCu solder system	Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R.
2006	TCAD simulation of local mechanical stress reduction by use of a compressive silicon nitride/silicon oxynitride etch stop bi-layer for CMOS performance enhancement	Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Chew, S.A. ; Yew, P.T.B.
2006	The characterization of KrF photoresists and the effect of different chromophore bulkiness on line edge roughness (LER) for submicron technology	Yusri, A. ; Bakri, M. ; Manaf, M.J. ; Wahab, K.I.A. ; Ahmad, I.B.
2006	Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength	Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y.
2006	Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance	Eu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K.
2006	Solder joint strength of lead free solders under multiple reflow and high temperature storage condition	Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S.
2006	Lead-free flux effect in lead-free solder joint improvement	Eu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K.
2006	The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging	Abdullah, S.H. ; Ahmad, I. ; Jalar, A.
2006	Performances test statistics for single outlier detection in bilinear (1,1,1,1) models	Zaharim, A. ; Mohamed, I. ; Ahmad, I. ; Abdullah, S. ; Omar, M.Z.
2006	Pulse power failure model of power MOSFET due to electrical overstress using tasca method	Ismail, N.S. ; Ahmad, I. ; Husain, H. ; Chuah, S.
2006	Solder bump strength and failure mode of low-k flip chip device	Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M.
2006	Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging	Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M.
2006	TCAD Simulation of STI stress effect on active length for 130nm technology	Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Yew, P.T.B.
2006	Impact of low-k devices on failure mode of flip chip tensile pull test	Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M.
2006	Fabrication of platinum membrane on silicon for MEMS microphone	Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I.
2006	Study of lifetime prediction of N-MOS transistor due to hot carrier effect	Ahmad, I. ; Kornain, Z. ; Idros, M.F.M.
2006	The effects of high temperature storage on lead free solder joint material strength using pull test method	Harif, M.N. ; Ahmad, I. ; Zaharim, A.
2007	HF etching of sacrificial spin-on glass in straight and junctioned microchannels for MEMS microstructure release	Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I.
2007	The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition	Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G.