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Issue Date	Title	Author(s)
2007	Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process	Md Arshad, M.K. ; Jalar, A. ; Ahmad, I.
2006	A study on lead free SnAgCu solder system	Hoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I.
2007	The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish	Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.
2007	A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish	Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I.
2007	Evaluation of different die attach film and epoxy pastes for stacked die QFN package	Ahmad, I. ; Bachok, N.N. ; Chiang, N.C. ; Talib, M.Z.M. ; Rosle, M.F. ; Latip, F.L.A. ; Aziz, Z.A.
2007	A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish	Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.
2007	Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods	Abdullah, I. ; Chiang, N.C. ; Mokhtar, U. ; Said, A. ; Talib, M.Z.M. ; Ahmad, I.
2007	Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish	Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A.
2007	Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish	Eu, P.-L. ; Ding, M. ; Ahmad, I.
2007	Dicing die attach film for 3D stacked die QFN packages	Abdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R.
2007	Optimization of nickel thickness on substrate for TBGA using SAC387 solder material	Ahmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P.
2008	Dicing laminated wafer for QFN 3D stacked die packaging	Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M.
2007	A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish	Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A.
2008	Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer	Hamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I.
2008	An efficient first order sigma delta modulator design	Amin, N. ; Guan, G.C. ; Ahmad, I.
2008	Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging	Hamzah, A.A. ; Husaini, Y. ; Majlis, B.Y. ; Ahmad, I.
2008	A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system	Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A.
2008	A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint	Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A.
2008	Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)	Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I.
2008	Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package	Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R.