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Issue Date	Title	Author(s)
2008	FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I.
2008	Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging	Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A.
2008	The effect of surface texturing on GaAs solar cell using TCAD tools	Jalil, S.M. ; Abdullah, L. ; Ahmad, I. ; Abdullah, H.
2008	An experimental study of defect determination using pulsed thermal non-destructive testing	Umar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W.
2008	A study of lead-free BGA backward compatibility through solderability testing at component level	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I.
2008	Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing	Ling, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I.
2008	Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology	Nor, N.H.M. ; Taib, S. ; Ahmad, I. ; Abdullah, H.
2008	Reduction of warpage occurrence on stack-die QFN using FEA and statistical method	Abdullah, I. ; Ahmad, I. ; Talib, M.Z.M. ; Kamarudin, M.N.B.C.
2008	The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA	Amin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I.
2009	Optimization of PV-Wind-Hydro-Diesel hybrid system by minimizing excess capacity	Ab. Razak, J. ; Sopian, K. ; Ali, Y. ; Alghoul, M.A. ; Zaharim, A. ; Ahmad, I.
2008	Improved series resistance model for CMOS ESD diodes	Kamal, N.B. ; Kordesch, A.V. ; Ahmad, I.B.
2009	Simulation of fabrication process VDMOSFET transistor using Silvaco software	Abdullah, H. ; Jurait, J. ; Lennie, A. ; Nopiah, Z.M. ; Ahmad, I.
2009	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages	Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I.
2009	Modelling and simulation single layer Anti-Reflective Coating of ZnO and ZnS for silicon solar cells using silvaco software	Abdullah, H. ; Lennie, A. ; Ahmad, I.
2009	Statistical design of ultra-thin SiO2 for nanodevices	Hashim, U. ; Abdul Fatah, M.F.A. ; Ahmad, I. ; Majlis, B.Y.
2009	BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy	Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A.
2009	Optimisation of N-channel trench power MOSFET using 2 k factorial design method	Nur, S.I. ; Ibrahim, A. ; Hafizah, H.
2009	Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement	Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A.
2010	Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages	Amin, N. ; Cheah, A.Y. ; Ahmad, I.
2010	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition	Harif, M.N. ; Ahmad, I.